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Manuscript/Mixed Material Binaud & Co to William Lee, July 2, 1803. Account.

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About this Item

Title

  • Binaud & Co to William Lee, July 2, 1803. Account.

Names

  • Lee, William (Addressee)
  • Binaud & Co

Created / Published

  • July 2, 1803

Headings

  • -  General Correspondence
  • -  Manuscripts
  • -  Correspondence

Genre

  • Manuscripts
  • Correspondence

Notes

Medium

  • Microfilm

Call Number/Physical Location

  • Series: Series 1, General Correspondence, 1723-1859
  • Microfilm Reel: 7

Source Collection

  • The James Madison Papers at the Library of Congress

Repository

  • Manuscript Division

Digital Id

Online Format

  • image

Rights & Access

The contents of the Library of Congress James Madison Papers are in the public domain and are free to use and reuse.

Credit Line: Library of Congress, Manuscript Division, James Madison Papers.

More about Copyright and other Restrictions.

For guidance about compiling full citations consult Citing Primary Sources.

Cite This Item

Citations are generated automatically from bibliographic data as a convenience, and may not be complete or accurate.

Chicago citation style:

Lee, William, and Binaud & Co. Binaud & Co to William Lee, July 2, . Account. July 2, 1803. Manuscript/Mixed Material. https://aj.sunback.homes/item/mjm014067/.

APA citation style:

Lee, W. & Binaud & Co. (1803) Binaud & Co to William Lee, July 2, . Account. July 2. [Manuscript/Mixed Material] Retrieved from the Library of Congress, https://aj.sunback.homes/item/mjm014067/.

MLA citation style:

Lee, William, and Binaud & Co. Binaud & Co to William Lee, July 2, . Account. July 2, 1803. Manuscript/Mixed Material. Retrieved from the Library of Congress, <aj.sunback.homes/item/mjm014067/>.